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Form Factor: M.2 2280
Interface: PCIe Gen3x4
Performance: 256GB —sequential read up to 3500MB/s, write up to 1300MB/s
IOPS: up to 92/240K
512GB —sequential read up to 3500MB/s, write up to 2400MB/s
IOPS: up to 200/256K
1TB —sequential read up to 3500MB/s, write up to 3000MBs
IOPS: up to 300/256K
2TB —sequential read up to 3500MB/s, write up to 3000MBs
IOPS: up to 300/256K
Operating Temperature: 0°C to 70°C (32°F to 158°F)
Storage Temperature: -40°C to 85°C (-40°F to 185°F)
Dimension (L x W x H): 80 mm x 22 mm x 2.25 mm / 3.15” x 0.87” x 0.09”
Weight: 9g
Shock Resistant: 1500 G, duration 0.5ms, Half Sine Wave
Vibration Resistant: 10~2000Hz, 1.5mm, 20 G, 1 Oct/min, 30min/axis(X,Y,Z)
TBW: 2TB:1000, 1 TB: 500 TB, 512 GB: 250 TB,, 256 GB: 125 TB
DWPD: 1 TB: 0.44, 512 GB: 0.44, 256 GB: 0.44
NAND flash: 3D TLC
MTBF: 1,500,000 Hours
1 Up to 3500MB/s read transfer, write transfer speeds lower. Speeds based on internal testing. Actual performance may vary.
2Shock resistant (1500G, duration 0.5ms, Half Sine Wave) and vibration resistant (10~2000Hz, 1.5mm, 20G, 1 Oct/min, 30min/axis(X,Y,Z)). Based on internal testing. Actual performance may vary.
3Comparison based on internal testing. Actual performance may vary.
[Note]:]
Security safeguards, by their nature, are capable of circumvention. Lexar does not guarantee data will be 100% secure from unauthorized access, alteration, or destruction.
Actual usable memory capacity may vary. 1GB equals 1 billion bytes.
Product appearance, performance, software offerings, and packaging may vary depending on ship date and available inventory.
Lexar is not liable for any loss of data or images.
