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Brand | Team Group |
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Series | T-FORCE CARDEA Z44Q |
Model | TM8FPQ002T0C327 |
Device Type | Internal Solid State Drive (SSD) |
Used For | Consumer |
Form Factor | M.2 2280 |
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Capacity | 2TB |
Interface | PCIe Gen4.0 x4, NVMe 1.4 |
Features | Enjoy PCIe Gen4, large capacity and fast speed all at once Two types of patented heat spreaders for you to choose from Effective cooling and installation is so easy Support the latest NVMe 1.4 specification |
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Operating Temperature | 0°C ~ +70°C |
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Storage Temperature | -40°C ~ +85°C |
Operating Humidity | RH 90% under 40°C (operational) |
Max Shock Resistance | 1,500G/0.5ms |
Max Vibration Resistance | 80Hz~2,000Hz/20G |
Height | 3.70mm (with Graphene heat sink) 12.90mm (with Aluminum heat sink) |
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Width | 22.00mm (with Graphene heat sink) 23.40mm (with Aluminum heat sink) |
Depth | 80.00mm |
Weight | 13.00g (with Graphene heat sink) 46.00g (with Aluminum heat sink) |
T-FORCE CARDEA Z44Q PCIe 4.0 SSD offers the best of two worlds: capacity and speed. It is an ideal storage solution for any demanding creators or gamers. With two types of heat spreaders provided, you can choose the type of heat dissipation you prefer. The installation of either heat spreader is easy.
T-FORCE CARDEA PCIe 4.0 Z44Q SSD adopts QLC Flash and supports the latest PCIe Gen4 x4 interface specifications, and has a capacity of up to 4TB to choose from. Up to 5,000/4,000 MB/s1, provides superior performance that is 15 times faster than ordinary SATA SSD. At the same time, it is backward compatible with PCIe 3.0 interface.
It is the first in the industry to offer two patented cooling modules, allowing you to choose your preferred cooling method between the patented aluminum fin type heat spreader with superior performance and the patented ultra-thin graphene heat spreader.
The patented high-strength aluminum heat sink features a unique thermal diversion design, capable of effectively reducing the temperature by up to 15%2. The patented ultra-thin graphene heat sink features graphene material with excellent thermal conduction performance, delivering heat dissipation rates of up to 9%3. Two patented heat sinks allow for flexible assembly without interference issues.
By supporting the latest NVMe 1.4 specification and optimizing the work division mechanism of NVM Sets and PLM (Predictable Latency Mode), it can effectively reduce latency time and the write loss and improve the QoS of the system. The use of the latest RRL (Read Recovery Level) technology can also improve the service life of SSD.
T-FORCE is TEAM force. The red “T” on the logo of “TF” represents TEAMGROUP’s passion for the storage products. The black “F” represents TEAMGROUP’s over 18 years of promotion of storage products. The visual design of the perfect combination elegantly symbolizes a pair of flying wings. They represent that the high quality and extreme performance gaming products from TEAMGROUP are capable of allowing all gamers to break the speed limit and enjoy the ever-changing world of gaming.
1. This product is compatible with Intel and AMD platforms, and the performance result is tested on a motherboard that supports PCIe 4.0 interface by the T-FORCE internal laboratory. The actual speed may vary depending on the software and hardware conditions of the platform.
2. With TEAMGROUP’s patented gaming fin type cooling module, both natural convection or forced air cooling (e.g. fan) can enhance heat dissipation. Long and rigorous test and burn-in test by the internal laboratory have proven that it can lower the temperature by up to 30? in open space and 10? in closed space, which provides more stable performance and extends the service life of the SSD.
3. The experimental data is based on T-FORCE internal laboratory's test result. Under the same condition, the temperature test data is according to the comparison of the non-heat spreader M.2 PCIe Gen4 x4 SSD and the T-FORCE CARDEA Z44Q Solid State Drive. The relevant test environment is simulated under a fanless environment using mask. The actual speed may vary depending on the software and hardware conditions of the platform.
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